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US 2009/0265928 A1Published application
Circuit board and manufacturing method thereof
OwnerJong-Bo SHIMinventor
Life of this patent
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Abstract
A circuit board may have a metal land supporting a pillar. The pillar may be fabricated by half-etching the metal land. An insulating layer may be provided on the circuit board so that the pillar of the metal land may be exposed through the insulating layer.
Claims11
A method for manufacturing a circuit board comprising:
- providing a resin layer having a bottom surface and a metal plate provided on the bottom surface of the resin layer;
- etching the metal plate to form a pillar;
- and
- patterning the metal plate to form a metal land having the pillar.
1 more element
A method for manufacturing a circuit board comprising:
- providing a resin layer having a bottom surface and a metal plate provided on the bottom surface of the resin layer;
- patterning the metal plate to form a metal land;
- and
- etching the metal land to form a pillar on the metal land.
1 more element
Dependencies are inferred from the claim text.