US 2009/0264582 A1Published application

Heat-resistant resin paste

AssigneeHitachi Chemical Company, Ltd.

InventorsHiroyuki Kawakami, Kouji Yamazaki, Takuya Imai, Youji Katayama

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Abstract

Provided is a heat-resistant resin paste excellent in heat resistance, flexibility, printability and viewability. A heat-resistant resin paste containing a first organic solvent (A1), a second organic solvent (A2) containing a lactone, a heat-resistant resin (B) soluble in a mixed solvent of the solvents (A1) and (A2), a heat-resistant resin filler (C) insoluble in the mixed organic solvent of the solvents (A1) and (A2), and a pigment (D), wherein the components (C) and (D) are dispersed in a solution containing the solvents (A1) and (A2) and the component (B).

Claims9

Dependent claims

A heat-resistant resin paste, comprising a first organic solvent (A1),

a second organic solvent (A2) containing a lactone,
a heat-resistant resin (B) soluble in the first organic solvent (A1) or a mixed solvent of the first organic solvent (A1) and the second organic solvent (A2),
a heat-resistant resin filler (C) insoluble in the mixed solvent of the first organic solvent (A1) and the second organic solvent (A2), and
a pigment (D),
wherein the heat-resistant resin filler (C) and the pigment (D) are dispersed in a solution containing the first organic solvent (A1), the second organic solvent (A2), and the heat-resistant resin (B).

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/375,719Filed 1 Jun 2007
Priority: JP 2006-20793131 Jul 2006
Published: 22 Oct 2009
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

C08J 3/005
Processes of treating or compounding macromolecular substances: processes for mixing polymers
C08G 73/1032
Characterised by the process itself, e.g. steps, continuous: characterised by the solvent used
C08G 73/105
Polyimides containing oxygen in the form of ether bonds in the main chain: with oxygen only in the diamino moiety
C08G 73/106
Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain: containing silicon

Family

US 8,759,440 B2Related patent
US 2009/0264582 A1This patent

From the US filing history. Foreign family members aren’t listed.

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