Liquid resin composition, semi-conductor device, and process of fabricating the same
AssigneePanasonic Electric Works Co., Ltd.
InventorsNaoki Kanagawa, Yasutaka Miyata
Life of this patent
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Abstract
A liquid resin composition for use as a sealing resin which reduces wear on a dicing blade or grinder employed for signularization or grinding. The liquid resin composition includes hollow and/or porous particles as a filler, and is adapted in use to be applied on a substrate constituting a semi-conductor device or electronic part.
Claims9
A room-temperature liquid resin composition adapted in use to be applied to a substrate of an electronic component as a sealing resin,
- said liquid resin composition comprising:
- 60% to 90% by weight of filler particles;
- an epoxy resin;
- a curing agent;
- and
- wherein
- said filler particles includes 40% or more by weight of porous and/or hollow particles.
3 A room-temperature liquid resin composition as set forth in claim 1, wherein said porous particles are bake-finished to have their surface sealed.
Dependencies are inferred from the claim text.