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US 2009/0261084 A1Published application
Laser Dicing Sheet and Manufacturing Method For Chip Body
AssigneeLintec Corporation
InventorsYoji Wakayama, Yosuke Sato, Naoki Taya
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Abstract
An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table. A laser dicing sheet according to the present invention comprising a base material comprising a polyurethane acrylate; and an adhesive layer formed on one surface thereof.
Claims7
A laser dicing sheet comprising:
- a base material comprising a polyurethane acrylate;
- and
- an adhesive layer formed on one face thereof.
Dependencies are inferred from the claim text.