Module for packaging electronic components by using a cap
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorJian Cheng CHEN
Life of this patent
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Abstract
A module for packaging electronic components includes a carrier, at least one electronic component and a cap. The carrier has a first region and a second region. The electronic component is disposed on the first region of the carrier. The cap is mounted on the second region, and includes an inner layer and an outer layer, wherein the inner layer is made of a non-conductive material, the outer layer is made of a conductive material, and the inner layer made of the non-conductive material covers the electronic components and the whole first region.
Claims27
A module for packaging electronic components comprising:
- a carrier having a first region and a second region;
- at least one electronic component disposed on the first region;
- and
- a cap mounted on the second region and comprising an inner layer and an outer layer, wherein the inner layer is made of a non-conductive material, the outer layer is made of a conductive material, the inner layer made of the non-conductive material covers the electronic components and the whole first region, and the inner layer contacts one of the electronic components.
A cap comprising:
- an inner layer;
- and
- an outer layer disposed on a surface of the inner layer so as to form a cap, wherein the cap has a top portion and an annular supporting portion physically connected to the top portion, the inner layer is made of a non-conductive material, and the outer layer is made of a conductive material.
A method for manufacturing a cap comprising the following steps of:
- providing an inner layer acted as a base layer;
- and
- forming an outer layer on a surface of the inner layer so as to form a cap, wherein the cap has a top portion and an annular supporting portion physically connected to the top portion, the inner layer is made of a non-conductive material, and the outer layer is made of a conductive material.
A method for manufacturing a cap comprising the following steps of:
- providing an outer layer acted as a base layer;
- and
- forming an inner layer on a surface of the outer layer so as to form a cap, wherein the cap has a top portion and an annular supporting portion physically connected to the top portion, the inner layer is made of a non-conductive material, and the outer layer is made of a conductive material.
Dependencies are inferred from the claim text.