Printed circuit board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChang Gun Oh, Mi Sun Hwang, Suk Won Lee
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Abstract
The printed circuit board includes the via formed with the electroplating layer unlike a conventional via formed with an electroless plating layer and an electroplating layer and having a cylindrical shape, and thus exhibits good interlayer electrical connection and high reliability of physical contact upon thermal stress caused by the variance in physical properties of material depending on changes in temperature. The via has no upper land, and thus a fine circuit pattern of the circuit layer can be formed on the via.
Claims9
A printed circuit board, comprising an insulating layer, a land formed under the insulating layer, a circuit pattern formed on the insulating layer, and a via for electrically connecting the land and the circuit pattern,
- wherein the land includes a seed layer and a first electroplating layer having one surface in contact with the seed layer and the other surface connected to the via, and the via is formed with a second electroplating layer.
A method of manufacturing a printed circuit board, comprising:
- (A) forming a seed layer on an entire surface of a core substrate having an insulating material;
- (B) forming a first resist layer, having an opening for a first circuit layer including a land of a via, on the seed layer,
- (C) plating the opening, thus forming the first circuit layer,
- (D) forming a second resist layer having a via hole on the first circuit layer so that the land is exposed;
- (E) plating the via hole, thus forming a via;
- (F) removing the first resist layer and the second resist layer, and exposing the insulating material of the core substrate corresponding to a portion where the first circuit layer is not provided;
- (G) forming an insulating layer on the first circuit layer;
- and
- (H) forming a second circuit layer, including a circuit pattern which is connected to an upper surface of the via, on the insulating layer.
Dependencies are inferred from the claim text.