Printed circuit board substrate and method for manufacturing printed circuit boards using same

A method for manufacturing printed circuit boards, comprising:

• providing a printed circuit board substrate including a metal-clad substrate and multiple spaced circuit substrates, {Mi}, i=1, 2, . . . , N, N being an integer greater than 2, the circuit substrates, {Mi}, mounted on the metal-clad substrate along an imaginary circle, the circuit substrates being equiangularly arranged about the center of the circle, the i+1th circuit substrate, Mi+1, being oriented 360/N degrees with respect to the ith neighboring circuit substrate, Mi;
• defining multiple processing regions, {Ki}, i=1, 2, . . . , N, N being an integer greater than 2, on the metal-clad substrate, the processing regions, {Ki}, spatially corresponding to the respective circuit substrates, {Mi};
• forming a photoresist layer on an opposite side of the metal-clad substrate to the circuit substrates, the photoresist layer including multiple photoresist layer sections, {Pi}, i=1, 2, . . . , N, N being an integer greater than 2, the photoresist layer sections, {Pi}, respectively located at the processing regions, {Ki};
• exposing the ith photoresist layer section, Pi, which spatially corresponds to the ith circuit substrate, Mi;
• rotating the printed circuit board substrate an angle of 360/N degrees about the center of the circle;
• exposing the i+1th photoresist layer section, Pi+1, which is proximate to the ith photoresist layer section, Pi and spatially corresponds to the i+1th circuit substrate, Mi+1;
• developing the ith photoresist layer section, Pi;
• etching the metal-clad substrate at the ith processing region, Ki to form electrically conductive patterns thereon;
• developing the i+1th photoresist layer section, Pi+1;
• etching the metal-clad substrate at the i+1th processing region, Ki+1 to form electrically conductive patterns thereon.