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US 2009/0260866 A1Published application
Wiring board and method for manufacturing the same
AssigneeImbera Electronics Oy
InventorsPetteri Palm, Arni Kujala
Life of this patent
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AssigneeImbera Electronics Oy
InventorsPetteri Palm, Arni Kujala
Estimating the term…
A method for manufacturing a wiring board, comprising the steps of mounting at least one structural aid on each side of a planar temporary bonding means, arranging a slot from the at least one structural aid on each side of the planar temporary bonding means, embedding the electrical component in the slot, such that the terminals of the electrical component face away from the planar temporary bonding means, mounting at least one electrical component on a component foil, such that the terminals of the electrical component face the component foil, mounting the component foil at least partially on the at least one structural aid, on each side of the planar temporary bonding means.
A method for manufacturing a wiring board, wherein the method comprises the steps of
A wiring board comprising at least one electrical component, a first structural aid and a second structural aid, wherein the wiring board comprises a planar temporary bonding means in between the first structural aid and the second structural aid, and a component foil mounted on the at least one electrical component which is embedded in a slot for an electrical component, wherein a slot is formed on each side of the planar temporary bonding means using a structural aid, and the component foil at least partly covers the structural aid from the side farther away from the planar temporary bonding means, and the terminals of the electrical component face away from the planar temporary bonding means.
Dependencies are inferred from the claim text.