Circuit board and semiconductor integrated circuit module including the same

A circuit board, comprising:

• a plurality of signal line layers configured to include a plurality of differential signal line pairs that provide differential signal pairs to a semiconductor integrated circuit chip;
• a plurality of electromagnetic bandgap (EBG) patterns configured to be disposed adjacent to each of the plurality of differential signal line pairs;
• and
• a plurality of insulating layers configured to be disposed between the plurality of signal line layers and the plurality of EBG patterns.

A semiconductor integrated circuit module, comprising:

• a circuit board;
• a memory control device configured to be mounted on the circuit board, and to generate and to output a plurality of differential signal pairs;
• a plurality of differential signal line pairs, each configured to be formed on the circuit board and to transmit a pair of the plurality of differential signal pairs;
• a semiconductor memory device configured to be mounted on the circuit board and to be supplied with the plurality of differential signal pairs transmitted along the plurality of differential signal line pairs;
• and
• a plurality of electromagnetic bandgap (EBG) patterns, each configured to be disposed in the circuit board and disposed at locations overlapping the plurality of differential signal line pairs.

A semiconductor integrated circuit module, comprising:

• a plurality of differential signal line pairs, each configured to transmit differential signal pairs;
• an input buffer configured to compare the differential signal pairs transmitted from each of the plurality of differential signal line pairs and to perform a buffering operation of signals of the differential signal pairs;
• and
• a board configured to include a plurality of electromagnetic bandgap (EBG) patterns,
• wherein the plurality of differential signal line pairs are disposed on a first side of the board and the EBG patterns are provided on a second side of the board.