Circuit modification device for printed circuit boards
OwnerAndrew Yaung, Neal S. Greenberginventors
Life of this patent
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Abstract
An electronic circuit modification apparatus to repair or modify portions of a printed circuit board comprises an adhesive layer, an insulating layer formed over the adhesive layer, and a plurality of electrically-conductive traces having an electrically-conductive bonding layer formed thereupon. The electrically-conductive bonding layer is configured to mechanically mount and electrically couple to a lead of an electrical component. At least one masking layer is positioned to electrically isolate the plurality of electrically-conductive traces, one from another.
Claims28
An electronic circuit modification apparatus, comprising:
- an adhesive layer;
- an insulating layer formed over the adhesive layer;
- a plurality of electrically-conductive traces having an electrically-conductive bonding layer formed thereupon, the electrically-conductive bonding layer configured to mechanically mount and electrically couple to a lead of an electrical component;
- and
- at least one masking layer positioned to electrically isolate the plurality of electrically-conductive traces, one from another.
A flexible circuit for repairing defects in a circuit assembly on a printed circuit board, the flexible circuit comprising:
- a pressure-sensitive adhesive layer having a release backing material affixed thereto, the release backing material configured to be readily removable;
- an insulating layer disposed over at least a portion of the pressure-sensitive adhesive layer;
- a plurality of electrically-conductive traces formed in contact with at least portions of the insulating layer, each of the plurality of electrically-conductive traces having an electrically-conductive bonding layer formed thereupon, the electrically-conductive bonding layer configured to mechanically mount and electrically couple to a lead of an electrical component;
- and
- at least one masking layer positioned to electrically isolate the plurality of electrically-conductive traces, one from another.
A flexible circuit modification device to repair defects in a circuit assembly on a printed circuit board, the flexible circuit comprising:
- a pressure-sensitive adhesive layer having a release backing material affixed thereto, the release backing material configured to be readily removable;
- an insulating layer disposed over at least a portion of the pressure-sensitive adhesive layer;
- a plurality of electrically-conductive traces in contact with at least portions of the insulating layer, each of the plurality of electrically-conductive traces having a solder-laden electrically-conductive bonding layer formed thereupon, the solder-laden electrically-conductive bonding layer configured to mechanically mount and electrically couple to a lead of an electrical component;
- and
- at least one masking layer formed to be at a higher cross-sectional level than an uppermost portion of the electrically-conductive bonding layer thereby forming a trench surrounding each of the solder-laden electrically-conductive bonding layers, the at least one masking layer being arranged to electrically isolate the plurality of electrically-conductive traces, one from another.
Dependencies are inferred from the claim text.