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US 2009/0260857 A1Published application
Heat resistant substrate incorporated circuit wiring board
AssigneeIbiden Co., Ltd.
InventorsTakashi Kariya, Toshiki Furutani, Takeshi Kawanishi
Life of this patent
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Abstract
A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and including a core substrate and a through hole conductor formed in the core substrate, the core substrate having a first surface and a second surface on an opposite side of the first surface, the through hole conductor providing electrical connection through the core substrate between the first surface and the second surface of the core substrate.
Claims12
A circuit wiring board comprising:
- a wiring substrate;
- and
- a heat resistant substrate accommodated in the wiring substrate and comprising a core substrate and a through hole conductor formed in the core substrate, the core substrate having a first surface and a second surface on an opposite side of the first surface, the through hole conductor providing electrical connection through the core substrate between the first surface and the second surface of the core substrate.
Dependencies are inferred from the claim text.