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US 2009/0260854 A1Published application
Electronic circuit board
OwnerShingo Komura, Katsushige Akeyama +1inventors
InventorsShingo Komura, Katsushige Akeyama, Motoo Yokoyama
Life of this patent
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Abstract
A resist opening 5a not covered with resist 4 around a through hole 2 provided through a board 1 is shaped so as to have a shape elongated in the direction of flow in flow soldering such that the surface tension acting on solder 6 upon the soldering is reduced.
Claims5
An electronic circuit board wherein a resist opening that is not covered with resist around a through hole provided through the board is shaped such that the surface tension acting on solder during the soldering is lowered.
Dependencies are inferred from the claim text.