Heat-activable adhesive tape particularly for bonding electronic components and conductor tracks
AssigneeTesa SE
InventorThorsten Krawinkel
Life of this patent
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Abstract
Heat-activable adhesive tape particularly for producing and further processing electronic components and conductor tracks, with an adhesive composed at least of a) a polyamide having terminal amino and/or acid groups, b) an epoxy resin, c) a compound having a long apolar chain with at least 6 carbon atoms and at least one reactive end capable of reacting with the epoxy resins, d) if desired, a plasticizer, the polyamide reacting with the epoxy resin at temperatures of at least 150° C., and the ratio in weight fractions of a) to b) lying between 50:50 to 99:1.
Claims12
Heat-activable adhesive tape for producing and further processing electronic components and conductor tracks, having an adhesive composed at least of
- a) a polyamide having terminal amino and/or acid groups,
- b) an epoxy resin,
- c) a compound having an apolar chain with at least 6 carbon atoms and at least one reactive end capable of reacting with the epoxy resins,
- d) optionally, a plasticizer,
- the polyamide being capable of reacting with the epoxy resin at temperatures of at least 150° C., and the weight ratio of a) to b) being between 50:50 to 99:1.
Dependencies are inferred from the claim text.