Method for bonding a first component to a second component

A process for bonding a first component to a second component that possesses a border area, with which the first component is overlappingly bonded, comprising the steps of:

• a) at least one hot melt adhesive compound is bonded to the first component such that on bonding the first component to the second component, said compound comes into contact with the border area;
• b) on at least one spot, on which said deposited hot melt adhesive compound comes into contact with the border area when bonding the first component, said border area is indirectly or directly locally heated by means of electromagnetic induction to a temperature above the melting point of the hot melt adhesive;
• c) the first component is contacted with the border area of the second component in such a way that the hot melt adhesive compound comes into contact with the spot of the border area which was heated in step b) such that the hot melt adhesive at the point of contact with the border area melts, and after cooling bonds the first component with the border area of the second component;
• d) wherein additionally, prior to step b) or after step c), a reactive adhesive is introduced between the first and the second component such that the reactive adhesive bonds the first component to the border area of the second component, and
• e) the reactive adhesive cures or is allowed to cure;
• wherein, in step a), the hot melt adhesive compound, without being heated, is adhered to the first component with help from a further adhesive.