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US 2009/0260675 A1Published application
Encapsulation of solar modules
OwnerSerkan Erdemli, Burak Metininventors
Life of this patent
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Abstract
A method for encapsulating interconnected solar cells including Group IBIIIAVIA absorbers and an apparatus according to the same, whereby a light receiving side encapsulant layer including thermoplastic polyurethane is used to cover the light receiving sides of the interconnected solar cells. The back sides of the interconnected solar cells are covered with a back side encapsulant layer that is different from the light receiving side encapsulant layer.
Claims18
A solar cell module, comprising:
- a solar cell device including at least two solar cells, each solar cell including a Group IBIIIAVIA absorber layer and a conductive substrate, wherein the solar cell device comprises a light receiving side having a light receiving surface and a back side having a back surface, the light receiving side of the device comprising the Group IBIIIAVIA absorber layer of each solar cell and the back side comprising the conductive substrate of each solar cell;
- a light receiving side encapsulant layer coating the light receiving surface, wherein the light receiving side encapsulant comprises a thermoplastic polyurethane;
- and
- a back side encapsulant layer coating the back surface, wherein the back side encapsulant layer is different from the light receiving side encapsulate layer.
1 more element
A method of manufacturing a solar module, comprising:
- providing a front protective layer having a front surface and a back surface, wherein the front protective layer is transparent;
- placing a light receiving side encapsulant layer over the back surface of the front protective layer, wherein the light receiving side encapsulant comprises thermoplastic polyurethane;
- placing a solar cell device over the light receiving side encapsulant layer, wherein the solar cell device includes at least two solar cells, and each solar cell includes a Group IBIIIAVIA absorber layer and a conductive substrate, the solar cell device comprising a light receiving side having a top surface and a back side having a back surface, the light receiving side of the device comprising the Group IBIIIAVIA absorber layer of each solar cell and the back side comprising the conductive substrate of each solar cell, and wherein the top surface of the solar cell device faces the light receiving side encapsulant layer;
- placing a back side encapsulant layer over the back surface of the solar cell device, wherein the back side encapsulant layer is different from the light receiving side encapsulant layer;
- placing a back protective layer over the back side encapsulant layer, and thereby forming a multilayer structure;
- subjecting the multilayer structure heat and pressure to melt the light receiving side encapsulant layer between the front protective layer and the solar light receiving side of the solar cell and back side encapsulant layer between the back side of the solar cell and the back protective layer;
- and
- cooling the multilayer structure to bond the light receiving side encapsulant layer between to the front protective layer and the solar light receiving side of the solar cell, and back side encapsulant layer to the back side of the solar cell and the back protective layer.
5 more elements
Dependencies are inferred from the claim text.