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US 2009/0260568 A1Published application
Glue dispenser and glue dispensing process
AssigneeHon Hai Precision Industry Co., Ltd.
InventorHsin-Hung Chuang
Life of this patent
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Abstract
An exemplary glue dispenser for dispensing a glue on a workpiece includes a nozzle for dispensing the glue on the workpiece, a working platform for supporting a workpiece thereon, and a heating device mounted on the working platform. The heating device is configured for maintaining the workpiece in an elevated temperature, which is higher than a temperature of the glue.
Claims10
A glue dispenser for dispensing a glue on a workpiece, comprising:
- a nozzle for dispensing the glue on the workpiece;
- a working platform for supporting the workpiece thereon;
- and
- a heating device mounted on the working platform and configured for maintaining the workpiece at an elevated temperature, the elevated temperature being higher than a temperature of the glue.
1 more element
A glue dispenser for dispensing a glue on a workpiece, comprising:
- a controller;
- a nozzle for dispensing a glue on a workpiece, the nozzle being connected with the controller;
- a working platform for supporting the workpiece thereon;
- a heating device mounted on the working platform and electrically connected with the controller, the heating device being configured for maintaining the workpiece at an elevated temperature, the elevated temperature being higher than a temperature of the glue;
- and
- a temperature detector configured for detecting a temperature of the workpiece, wherein the temperature detector is electrically connected with the controller, and r is for thermally connecting with the workpiece.
3 more elements
A dispensing process for applying a glue onto a workpiece, the process comprising:
- heating a workpiece to an elevated temperature, the elevated temperature being higher than a temperature of the glue;
- and
- applying the glue onto the workpiece.
Dependencies are inferred from the claim text.