Methods and Apparatus for Heat Transfer for a Component

A heat transfer device for an integrated circuit comprising a die and a substrate, comprising:

• a lid configured to engage the integrated circuit, comprising:
• a thermally conductive body with substantially the same area as the integrated circuit, wherein the thermally conductive body is adapted to absorb heat from the die;
• and
• a plurality of hardstops configured to:
• be positioned on the surface of the substrate;
• prevent direct contact between the thermally conductive body and the die;
• and
• limit a bond line distance between the thermally conductive body and the die;
• and
• a thermal interface material located between the integrated circuit and the lid, wherein the thermal interface material is adapted to provide thermally conductive adhesive bond between the lid and the integrated circuit.

A method for cooling an integrated circuit with a die, comprising:

• securing a thermally conductive lid comprising a hardstop to the surface of the integrated circuit with a first thermally conductive adhesive material, wherein:
• the hardstop is configured to limit a bond line distance between the thermally conductive lid and the die, and
• the first thermally conductive material comprises an aluminum oxide filled room temperature vulcanizing silicone;
• and
• affixing a heat sink to the thermally conductive lid with a second thermally conductive adhesive material.