Thermoplastic resin composition, material for substrate and film for substrate

A process for a molded article which is shaped by molding, said process comprising:

• preparing a material comprising a thermoplastic resin composition containing 100 parts by weight of a thermoplastic resin and 0.1 to 100 parts by weight of an inorganic compound dispersed in said thermoplastic resin in a die by transferring a shape of the die the inorganic compound being at least one of silica and laminar silicate, and the dispersion particle diameter of the silica being 2 μm or less and the laminar silicate having an average length of 0.01 to 3 μm;
• heating said thermoplastic resin composition;
• pressing said thermoplastic resin composition in a softened state to the die;
• cooling said thermoplastic resin composition to a temperature between the glass transition temperature minus 20° C. or higher;
• and peeling said thermoplastic resin composition from the die at a temperature between the glass transition temperature minus 20° C. or higher so that the molded article wherein not less than 75% of the shape of the article molded before cooling is maintained at temperatures above the glass transition point of said thermoplastic resin.