Final via structures for bond pad-solder ball interconnections

A structure, comprising:

• a first dielectric layer;
• an electrically conductive bond pad on the first dielectric layer;
• a second dielectric layer on top of the first dielectric layer and the electrically conductive bond pad,
• wherein the electrically conductive bond pad is sandwiched between the first and second dielectric layers,
• wherein the second dielectric layer comprises N separate final via openings, and
• wherein N is a positive integer greater than 1;
• N final vias, wherein the N final vias partially fill one-to-one the N final via openings;
• and
• a solder ball,
• wherein each final via of the N final vias is in direct physical contact with the solder ball, and
• wherein the solder ball is electrically connected to the electrically conductive bond pad through the N final vias.

A structure formation method, comprising:

• providing a structure which includes:
• a first dielectric layer,
• an electrically conductive bond pad on the first dielectric layer, and
• a second dielectric layer on top of the first dielectric layer and the electrically conductive bond pad, wherein the electrically conductive bond pad is sandwiched between the first and second dielectric layers;
• and
• creating N final via openings in the second dielectric layer such that a top surface of the electrically conductive bond pad is exposed to a surrounding ambient through each final via opening of the N final via openings, wherein N is a positive integer greater than 1.