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US 2009/0256256 A1Published application
Electronic Device and Method of Manufacturing Same
AssigneeInfineon Technologies AG
InventorThorsten MEYER
Life of this patent
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Abstract
This application relates to a semiconductor device comprising an array of contact elements soldered to only one surface, wherein the array defines a predetermined pitch length, wherein the contact elements comprise a spherically shaped element and wherein the contact elements protrude from the only one surface by more than 60 percent of the predetermined pitch.
Claims15
A semiconductor device comprising:
- an array of contact elements soldered to only one surface, the array defining a predetermined pitch length;
- wherein the contact elements comprise a spherically shaped element;
- and
- wherein the contact elements protrude from the only one surface by more than 60 percent of the predetermined pitch length.
1 more element
A semiconductor device comprising:
- an array of contact elements soldered to only one surface, the array defining a predetermined pitch length;
- wherein each of the contact elements comprises a spherically shaped element, each spherically shaped element having a diameter larger than 60 percent of the predetermined pitch length.
Dependencies are inferred from the claim text.