Continuously Referencing Signals Over Multiple Layers in Laminate Packages

A method of fabricating a laminate chip package, comprising:

• receiving a laminate package design for a laminate chip package having a plurality of insulator layers and a plurality of patterned conductive layers comprising a first conductive layer, a fourth conductive layer, and two intermediate conductive layers;
• identifying a first preferred voltage plane for the first conductive layer within a first area of the laminate package design;
• identifying a second preferred voltage plane for the first conductive layer within a second area of the laminate package design, wherein the first preferred voltage plane is one of a source voltage plane or a ground plane and the second preferred voltage plane is the other of the source voltage plane and the ground plane;
• positioning signal planes, source voltage planes, and ground planes within the plurality of conductive layers such that a path of the signal plane maintains a relatively consistent impedance from beneath the first area to beneath the second area by a balanced proximity to a conductive layer connected to the source voltage and a conductive layer connected to ground potential, without adding layers to the laminate package design, to form a mixed voltage plane package design;
• and
• fabricating the laminate chip package based on the mixed voltage plane package design.

A system for fabricating a laminate chip package, comprising:

• a package design system that provides a laminate package design for a laminate chip package having a plurality of insulator layers and a plurality of patterned conductive layers comprising a first conductive layer, a fourth conductive layer, and two intermediate conductive layers;
• a design analysis engine that identifies a first preferred voltage plane for the first conductive layer within a first area of the laminate package design and a second preferred voltage plane for the first conductive layer within a second area of the laminate package design, wherein the first preferred voltage plane is one of a source voltage plane or a ground plane and the second preferred voltage plane is the other of the source voltage plane and the ground plane;
• a reference plane adjustment engine that positions signal planes, source voltage planes, and ground planes within the plurality of conductive layers such that a path of the signal plane maintains a relatively consistent impedance from beneath the first area to beneath the second area by a balanced proximity to a conductive layer connected to the source voltage and a conductive layer connected to ground potential, without adding layers to the laminate package design, to form a mixed voltage plane package design;
• and
• a package fabrication system that fabricates the laminate chip package based on the mixed voltage plane package design.

A laminate chip package fabricated by a process comprising:

• receiving a laminate package design for a laminate chip package having a plurality of insulator layers and a plurality of patterned conductive layers comprising a first conductive layer, a fourth conductive layer, and two intermediate conductive layers;
• identifying a first preferred voltage plane for the first conductive layer within a first area of the laminate package design;
• identifying a second preferred voltage plane for the first conductive layer within a second area of the laminate package design, wherein the first preferred voltage plane is one of a source voltage plane or a ground plane and the second preferred voltage plane is the other of the source voltage plane and the ground plane;
• positioning signal planes, source voltage planes, and ground planes within the plurality of conductive layers such that a path of the signal plane maintains a relatively consistent impedance from beneath the first area to beneath the second area by a balanced proximity to a conductive layer connected to the source voltage and a conductive layer connected to ground potential, without adding layers to the laminate package design, to form a mixed voltage plane package design;
• and
• fabricating the laminate chip package based on the mixed voltage plane package design.