Semiconductor packaging techniques
AssigneeVishay-Siliconix
InventorsMike Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Lixiong Luo, Wei-Bing Chu
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.
Claims24
A method of fabricating a semiconductor package comprising electrically coupling a first contact on a first side of a die to a first portion of a lead frame such that a second portion of the lead frame is coplanar to a second contact on a second side of the die, wherein the first side of the die is oppositely disposed from the second side of the die.
A method of fabricating a semiconductor package comprising attaching a first surface of a semiconductor die to a first portion of a lead frame using a conductive epoxy wherein a second portion of the lead frame is coplanar with a second surface of the semiconductor die.
A semiconductor package comprising:
- a die including a first contact on a first side and a second contact on a second side, wherein the second side is oppositely disposed from the first side;
- and
- a lead frame including a first portion electrically coupled to the first contact on the die, a second portion disposed coplanar to the second contact on the die but electrically isolated from the second contact, and a third portion extending between the first and second portion.
Dependencies are inferred from the claim text.