Packaging method of image sensing device
AssigneeImpac Technology Co., Ltd.
InventorChih-Yang Hsu
Life of this patent
Estimating the term…
Abstract
A packaging method for an image sensing device is disclosed. The packaging method includes the steps of a) providing an annular dam on a substrate; b) mounting an image sensing module, having a light-receiving region exposed, inside the annular dam on the substrate; c) connecting the image sensing module and the substrate via a plurality of bonding wires; d) forming a barrier around the light-receiving region on the image sensing module; e) filling an adhesive between the barrier and the annular dam with the plurality of bonding wires being encapsulated; f) forming a transparent lid above the light-receiving region; and g) cutting off the annular dam.
Claims16
A packaging method for an image sensing device, comprising the steps of:
- a) providing an annular dam on a substrate;
- b) mounting an image sensing module, having a light-receiving region exposed, inside said annular dam on said substrate;
- c) connecting said image sensing module and said substrate via a plurality of bonding wires;
- d) forming a barrier around said light-receiving region on said image sensing module;
- e) filling an adhesive between said barrier and said annular dam with said plurality of bonding wires being encapsulated;
- f) forming a transparent lid above said light-receiving region;
- and
- g) cutting off said annular dam.
An image sensing device, comprising:
- a substrate;
- an image sensing module mounted on said substrate, having a light-receiving region exposed;
- a plurality of bonding wires for connecting said image sensing module and said substrate;
- a barrier formed around said light-receiving region on said image sensing module;
- an adhesive filled around said barrier with said plurality of bonding wires being encapsulated;
- and
- a transparent lid formed above said light-receiving region.
Dependencies are inferred from the claim text.