Method of depositing materials on a non-planar surface

An apparatus for semiconductor processing onto a non-planar substrate, comprising:

• a. a semiconductor process chamber having an ingress and an egress, wherein the ingress and egress are operable to allow passage of at least one non-planar substrate therethrough;
• b. means for moving the at least one non-planar substrate down a translational path through the semiconductor process chamber;
• c. means for rotating the at least one non-planar substrate as the non-planar substrate moves down the translational path through the semiconductor process chamber;
• and
• d. means for performing a semiconductor process on the at least one non-planar substrate concurrently with the rotation of the at least one non-planar substrate down the translational path such that at least a portion of the surface area of the at least one non-planar substrate is exposed to the semiconductor process.

An apparatus for semiconductor processing onto a non-planar substrate, comprising:

• a. a semiconductor process chamber having an ingress and an egress, wherein the ingress and egress are operable to allow passage of at least one non-planar substrate therethrough;
• b. a motion mechanism for moving the at least one non-planar substrate down a translational path through the semiconductor process chamber;
• c. a rotation mechanism for rotating the at least one non-planar substrate as the non-planar substrate moves down the translational path through the semiconductor process chamber;
• and
• d. a semiconductor process module coupled to the semiconductor process chamber for performing a semiconductor process on the at least one non-planar substrate concurrently with the rotation of the at least one non-planar substrate down the translational path such that at least a portion of the surface area of the at least one non-planar substrate is exposed to the semiconductor process.