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US 2009/0253276 A1Published application
Burn-in socket
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorChun-Fu Lin
Life of this patent
Estimating the term…
Abstract
A burn-in socket for testing an integral circuit package includes a base defining a cavity, an adapter received in the cavity of the base, an alignment plate secured to the adapter, and a cover movable mounted to the base. The alignment plate is detachable assembled to the adapter so as to the burn-in socket can apply to different IC package when the alignment plate is replaced with another.
Claims16
A burn-in socket for testing an integral circuit (IC) package comprising:
- a base defining a cavity,
- an adapter received in the cavity of the base and including a plurality of latches, the adapter defining a first opening and providing a supporting face for abutting the IC package;
- an alignment plate received in the first opening of the adapter and engaging with the latches of the adapter, the alignment plate defining a second opening extending therethrough for positioning the IC package therein, and
- a cover movable mounted to the base from an open to a closed position and having hooks engaging with the base at the closed position.
1 more element
A burn-in socket for testing an integral circuit (IC) package comprising:
- a base defining a cavity,
- an adapter received in the cavity of the base, the adapter having a top face and a supporting face jointly defining a first opening;
- an alignment plate detachable assembled to the adapter and received in the first opening of the adapter, the alignment plate defining a second opening extending therethrough for positioning the IC package, thickness of the alignment plate being smaller than height of the recess, and
- a cover rotatably mounted to the base from an open to a closed position and having hooks engaging with the base at the closed position.
1 more element
A burn-in socket for testing an integral circuit (IC) package comprising:
- a base defining a receiving cavity,
- an adapter received in the receiving cavity and downwardly fastened to the base via first securing devices, the adapter defining a first opening and providing a supporting face for abutting the IC package;
- an alignment plate received in the first opening and downwardly locked to the adapter via second securing devices, the alignment plate defining a second opening extending therethrough for positioning the IC package therein, and
- a cover movable mounted to the base from an open to a closed position and having hooks engaging with the base at the closed position;
- wherein
- both said first securing devices and said second securing devices are located on four corners of the receiving cavity.
3 more elements
Dependencies are inferred from the claim text.