Lead frame module for manufacturing light emitting diodes
AssigneesSilitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corporation
InventorCheng-Hong Su
Life of this patent
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Abstract
A lead frame module integrally formed from a single thin metal sheet includes: parallel first and second rails extending in a first direction; and first and second lead frame sets connected to the first and second rails, respectively. The first and second lead frame sets respectively include a plurality of lead frames extending in a second direction perpendicular to the first direction. Each of the lead frames of the first and second lead frame sets has a pair of connecting leads and a pair of packaging leads. Each of the packaging leads is connected to a respective one of the connecting leads. The connecting leads of the lead frames of the first lead frame set are interdigitated with and are connected to the connecting leads of the lead frames of the second lead frame set.
Claims15
A lead frame module for manufacturing light emitting diodes, said lead frame module being integrally formed from a single thin metal sheet, and comprising:
- a first rail extending in a first direction;
- a first lead frame set including a plurality of lead frames disposed along a length of said first rail, each of said lead frames of said first lead frame set being connected to said first rail and extending in a second direction perpendicular to the first direction;
- a second rail parallel to and spaced apart from said first rail;
- and
- a second lead frame set including a plurality of lead frames disposed along a length of said second rail, each of said lead frames of said second lead frame set being connected to said second rail and extending in the second direction;
- wherein each of said lead frames of said first and second lead frame sets has a pair of connecting leads for electrical connection and a pair of packaging leads for mounting a light emitting chip thereon, each of said packaging leads being connected to a respective one of said connecting leads;
- and
- wherein said connecting leads of said lead frames of said first lead frame set are interdigitated with and are connected to said connecting leads of said lead frames of said second lead frame set.
A lead frame module for manufacturing side view type light emitting diodes, said lead frame module being integrally formed from a single thin metal sheet, and comprising:
- a first rail extending in a first direction;
- a first lead frame set including a plurality of lead frames disposed along a length of said first rail, each of said lead frames of said first lead frame set being connected to said first rail and extending in a second direction perpendicular to the first direction;
- a second rail parallel to and spaced apart from said first rail;
- a second lead frame set including a plurality of lead frames disposed along a length of said second rail, each of said lead frames of said second lead frame set being connected to said second rail and extending in the second direction;
- first and second locating-hole-providing rails extending respectively in the first direction with said first and second rails disposed therebetween;
- a plurality of third rails extending in the second direction and connecting said first locating-hole-providing rail to said first rail;
- and
- a plurality of fourth rails extending in the second direction and connecting said second locating-hole-providing rail to said second rail;
- wherein each of said lead frames of said first and second lead frame sets has a pair of connecting leads for electrical connection and a pair of packaging leads for mounting a light emitting chip thereon, each of said packaging leads being connected to a respective one of said connecting leads;
- and
- wherein said connecting leads of said lead frames of said first lead frame set are interdigitated with and are connected to said connecting leads of said lead frames of said second lead frame set.
A lead frame module for manufacturing top view type light emitting diodes, said lead frame module being integrally formed from a single thin metal sheet, and comprising:
- a first rail extending in a first direction;
- a first lead frame set including a plurality of lead frames disposed along a length of said first rail, each of said lead frames of said first lead frame set being connected to said first rail and extending in a second direction perpendicular to the, first direction;
- a second rail parallel to and spaced apart from said first rail;
- a second lead frame set including a plurality of lead frames disposed along a length of said second rail, each of said lead frames of said second lead frame set being connected to said second rail and extending in the second direction;
- and
- a third rail extending in the first direction between said first and second rails;
- wherein each of said lead frames of said first and second lead frame sets has a pair of connecting leads for electrical connection, each of which is connected to said third rail, and a pair of packaging leads for mounting a light emitting chip thereon, each of said packaging leads being connected to a respective one of said connecting leads;
- and
- wherein said connecting leads of said lead frames of said first lead frame set are interdigitated with said connecting leads of said lead frames of said second lead frame set.
Dependencies are inferred from the claim text.