Suspension microstructure and a fabrication method for the same

A method for fabricating a suspension microstructure comprising the steps of:

• forming an insulation layer including inner micro-electro-mechanical structures on an upper surface of a silicon substrate, the micro-electro-mechanical structure including at least one microstructure and a plurality of metal circuits that are independent from each other, the micro-electro-mechanical structures having an exposed portion on a surface of the insulation layer, the exposed portion being provided with through holes correspondingly to predetermined etching spaces of the micro-electro-mechanical structures, which only penetrates the insulation layer without contacting the micro-electro-mechanical structures;
• next, forming a photoresist with an opening on the insulation layer, the opening of the photoresist being located outside the through holes of the exposed portion;
• subsequently, conducting an etching from the through holes of the exposed portion downwards to form etching spaces which only penetrate the insulation layer, the microstructures of the micro-electro-mechanical structures being clad in the insulation layer;
• and
• realizing suspension of the microstructures by etching.

A method for fabricating a suspension microstructure comprising the steps of:

• forming an insulation layer including inner micro-electro-mechanical structures on an upper surface of a silicon substrate, the micro-electro-mechanical structure including at least one independent microstructure, the micro-electro-mechanical structures having an exposed portion on a surface of the insulation layer, under the exposed portion being provided a plurality of mutually-conducted stacked metal-via layers correspondingly to predetermined etching spaces, the stacked metal-via layers reaching the upper surface of the silicon substrate and only penetrating the insulation layer without contacting the micro-electro-mechanical structures;
• next, forming a photoresist with an opening on the insulation layer, the opening of the photoresist being located outside the exposed portion;
• subsequently, removing the exposed portion and all the stacked metal-via layers by etching to form etching spaces only penetrating the insulation layer;
• and
• conducting an etching from the etching spaces downwards to realize suspension of the microstructures.

A method for fabricating a suspension microstructure comprising the steps of:

• forming an insulation layer including inner micro-electro-mechanical structures on an upper surface of a silicon substrate, the micro-electro-mechanical structure including at least one microstructure and a plurality of metal circuits that are independent from each other, the micro-electro-mechanical structures having an exposed portion and an embedded portion, the exposed portion being provided with through holes correspondingly to predetermined etching spaces of the micro-electro-mechanical structures, the embedded portion being lower than the exposed portion and located in a predetermined etching space of the through holes, which only penetrates the insulation layer without contacting the micro-electro-mechanical structures;
• next, forming a photoresist with an opening on the insulation layer, the opening of the photoresist being located outside all the through holes of the exposed portion;
• subsequently, conducting an etching from the through holes of the exposed portion downwards to etch etching spaces in the insulation layer, the embedded portion is lower than the exposed portion and located in the predetermined etching space of the through holes, so that a sunken space is etched above the embedded portion, the etching spaces and the sunken space only penetrate the insulation layer without contacting the micro-electro-mechanical structures;
• removing a part of the exposed portion within the opening of the photoresist and the exposed embedded portion;
• and
• etching a predetermined space toward the silicon substrate to realize suspension of the microstructures of micro-electro-mechanical structures.