Wafer heating apparatus having electrostatic attraction function
AssigneeShin-Etsu Chemical Co., Ltd.
InventorShoji Kano
Life of this patent
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Abstract
In a wafer heating apparatus having an electrostatic attraction function, a conductive heat generating layer is formed on one plane of a supporting substrate, and a conductive electrode for electrostatic attraction is formed on the other plane, and furthermore, an insulating layer is formed to cover the heat generating layer and the electrode for electrostatic attraction. The wafer heating apparatus has the electrostatic attraction function characterized in that the insulating layer covering the electrode for electrostatic attraction has a lower surface resistivity (ρsE) in a portion on the side of an object to be attracted compared with a surface resistivity (ρsE) in a portion on the side of the electrostatic attraction electrode.
Claims7
A wafer heating apparatus having a function of electrostatically attracting a workpiece, comprising a conductive heating layer formed on one surface of a support substrate, a conductive electrode for electrostatic attraction formed on another surface of the support substrate, and an insulating layer formed to cover the heating layer and the electrode for electrostatic attraction, characterized in that said insulating layer covering the electrode includes a region adjoining the electrode and another region disposed to adjoin the workpiece, and the workpiece-adjoining region has a surface resistivity (ρsS) lower than the surface resistivity (ρsE) of the electrode-adjoining region.
A wafer heating apparatus having a function of electrostatically attracting a workpiece, comprising a conductive heating layer formed on one surface of a support substrate, a conductive electrode for electrostatic attraction formed on another surface of the support substrate, and an insulating layer formed to cover the heating layer and the electrode for electrostatic attraction, characterized in that said insulating layer covering the electrode includes a region adjoining the electrode and another region disposed to adjoin the workpiece, that a ratio (ρsE/ρsS) of a surface resistivity (ρsE) of the electrode-adjoining region to a surface resistivity (ρsS) of the workpiece-adjoining region is up to 100, and that the surface resistivities (ρsE and ρsS) are each at least 1×108 Ω/square.
Dependencies are inferred from the claim text.