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US 2009/0242129 A1Published application
Thermal processing apparatus and processing system
AssigneeTokyo Electron Limited
InventorsTadashi Onishi, Shigeki Tozawa, Yusuke Muraki, Takafumi Nitoh
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Abstract
A heat treatment apparatus for heat-treating a silicon substrate includes a mounting table for mounting and heating the silicon substrate thereon, wherein a cover made of any of silicon, silicon carbide, and aluminum nitride is placed on an upper surface of the mounting table. By covering the upper surface of the mounting table by the cover made of silicon or the like, metal contamination of the lower surface of the silicon substrate is suppressed.
Claims6
A heat treatment apparatus for heat-treating a silicon substrate, comprising:
- a mounting table for mounting and heating the silicon substrate thereon,
- wherein a cover made of any of silicon, silicon carbide, and aluminum nitride is placed on an upper surface of said mounting table.
Dependencies are inferred from the claim text.