Back to results
US 2009/0233799 A1Published application
Composite superconductive wire-material, manufacturing method of composite superconductive wire-material, and superconductive cable
AssigneesFurukawa Electric Co., Ltd., Int. Superconductivity Tech Ctr the Juridical Fdn.
InventorsMasashi YAGI, Hirao Hirata, Shinichi Mukoyama, Yuh Shiohara
Life of this patent
Estimating the term…
Abstract
A thin film superconductive wire material (16) and an electro conductive tape (15) are immersed in a solder bath (35) containing a solder, which includes Sn(tin) and Bi(bismuth), to bond the thin film superconductive wire material (16) and the electro conductive tape (15) and a composite superconductive wire material (10) is formed.
Claims8
A composite superconductive wire-material comprising:
- a thin-film superconductive wire-material including:
- a substrate;
- a superconductive layer;
- and a stabilizing layer;
- arranged in this order;
- and
- an electroconductive tape material formed on the stabilizing layer, with a lead-free solder which is interposed therebetween and which includes at least Sn and Bi.
4 more elements
A manufacturing method of a composite superconductive wire-material, which comprises the steps of:
- preparing a composite superconductive wire-material comprising:
- a thin-film superconductive wire-material including:
- a substrate;
- a superconductive layer;
- and a stabilizing layer;
- arranged in this order;
- abutting the thin-film superconductive wire-material and the electroconductive tape to each other;
- immersing at least a part of an abutment area, the abutment area comprising the thin-film superconductive wire-material and the electroconductive tape abutted to each other, into a molten solder in a solder bath to bond the thin-film superconductive wire-material and the electroconductive tape to each other, thereby forming a composite superconductive wire-material bondedly formed by the solder;
- and
- transporting the composite superconductive wire-material to the outside of the solder bath;
- and
- that the solder is a lead-free solder comprising at least Sn and Bi.
9 more elements
Dependencies are inferred from the claim text.