Polishing liquid and polishing method
AssigneeFUJIFILM Corporation
InventorToshiyuki Saie
Life of this patent
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Abstract
A polishing liquid is provided which has good storage stability and is capable of inhibiting generation of scratching caused by aggregation of solid abrasive grains or the like during use. A polishing method using the polishing liquid is also provided. The polishing liquid includes: (a) an aqueous solution A including colloidal silica particles in an amount of from 5 mass % to 40 mass % with respect to the total mass of the aqueous solution A, and having a pH of from 1 to 7; and (b) an aqueous solution B including a quaternary ammonium cation, wherein the aqueous solution A and the aqueous solution B are separately prepared and mixed to provide the polishing liquid immediately before used in polishing.
Claims10
A polishing liquid used for chemical mechanical polishing in planarization of a semiconductor device, comprising:
- an aqueous solution A including colloidal silica particles in an amount of from 5 mass % to 40 mass % with respect to the total mass of the aqueous solution A, and having a pH of from 1 to 7;
- and
- an aqueous solution B including a quaternary ammonium cation,
- wherein the aqueous solution A and the aqueous solution B are prepared separately and subsequently mixed to provide the polishing liquid.
A chemical mechanical polishing method, comprising:
- preparing an aqueous solution A including colloidal silica particles in an amount of from 5 mass % to 40 mass % with respect to the total mass of the aqueous solution A, and having a pH of from 1 to 7, and an aqueous solution B including a quaternary ammonium cation;
- mixing the aqueous solution A and the aqueous solution B to obtain a polishing liquid;
- diluting the polishing liquid with water or an aqueous solution;
- and
- polishing a surface while supplying the diluted polishing liquid to a polishing pad on a polishing platen such that the polishing pad contacts the surface, and the polishing pad and the surface move relatively to each other.
Dependencies are inferred from the claim text.