Method of Detaching a Thin Semiconductor Circuit From Its Base
AssigneeKoninklijke Philips Electronics N.V.
InventorsAndreas Gakis, Wolfgang Schnitt
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Abstract
In order to provide a method of detaching a thin semiconductor circuit (1) from its base (2), wherein the semiconductor circuit (1) is provided with terminals (3) for electrical contacting, in particular with gold contacts, by means of which method thin semiconductor circuits (1) can also be mounted without damage for example directly on a chip card, it is proposed that a layer of soldering tin (6) is applied to a support substrate (4), the support substrate (4) is soldered to the electrical terminals (3) and the base (2) of the semiconductor circuit (1) is removed.
Claims8
A method of detaching a thin semiconductor circuit from its base wherein the semiconductor circuit is provided with terminals for electrical contacting, in particular with gold contacts, characterized in that a layer of soldering tin is applied to a support substrate the support substrate is soldered to the electrical terminals and the base of the semiconductor circuit is removed.
Dependencies are inferred from the claim text.