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AssigneeApplied Materials, Inc.
InventorsIMAD YOUSIF, Ying Rui, Nancy Fung, Martin Jeffrey Salinas, Ajit Balakrishna, Anchel Sheyner, Shahid Rauf, Walter R. Merry
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Embodiments of the present invention provide apparatus and method for front side protection while processing side and backside of a substrate. One embodiment of the present invention provides a showerhead configured to provide a purge gas to a front side of a substrate during a backside etch processing. The showerhead comprises a body configured to be disposed over the front side of the substrate. The body has a process surface configured to face the front side of the substrate. The process surface has an outer circular region, a central region, a middle region between the outer central region and the central region. The first plurality of holes are distributed in the outer circular region and configured to direct the purge gas towards an edge area of the front side of the substrate. No gas delivery hole is distributed within a substantial portion of the middle region.
A showerhead configured to provide a purge gas to a front side of a substrate during a backside processing, comprising:
A method for cleaning a backside of a substrate, comprising:
The method of claim 19, wherein the first and second plurality of holes are distributed in a recess surrounded by a side wall extending from a body of the showerhead.
An apparatus for processing a substrate, comprising:
Dependencies are inferred from the claim text.