Heat dissipation device
AssigneeInventec Corporation
InventorsShaw-Fuu WANG, Ting-Chiang HUANG, Shih-Chen SHEN, Sheng-Jie SYU
Life of this patent
Estimating the term…
Abstract
A heat dissipation device, electrically connected to an intermittent power source, is used for dissipating heat generated by a heat-generating element on a circuit board. The heat dissipation device has at least one coil and at least one vibrating sheet. The coil is used to receive the intermittent power source to produce a magnetic field. One end of the vibrating sheet is fixed, and the other end is suspended over the coil. The suspended end flutters periodically under the magnetic force of the intermittent magnetic field, so as to produce an airflow.
Claims10
A heat dissipation device, electrically connected to an intermittent power source, for dissipating heat generated by at least one heat-generating element on a circuit board, the heat dissipation device comprising:
- at least one coil for receiving the intermittent power source to produce a magnetic field;
- a support block disposed on the circuit board;
- and
- at least one vibrating sheet, having a fixed portion, a movable portion extending from the fixed portion, and a flexible portion jointing between the fixed portion and the movable portion, wherein the fixed portion is fixed on the support block disposed on the circuit board, and the movable portion is suspended over the coil via the flexible portion so that the movable portion flutters periodically under the magnetic force of the magnetic field, so as to produce an airflow, and wherein an area of cross section of the flexible portion is smaller than that of the fixed portion.
(canceled)
(canceled)
(canceled)
Dependencies are inferred from the claim text.