Electronic device
AssigneeKabushiki Kaisha Toshiba
InventorTakeshi Hongo
Life of this patent
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Abstract
According to one embodiment, an electronic device comprises a circuit component, a heat sink configured to dissipate heat generated by the circuit component to the outside, and a first heat transfer sheet and a second heat transfer sheet that are arranged adjacent to each other between the circuit component and the heat sink and have thermal conductivity for thermally connecting the circuit component to the heat sink. The second heat transfer sheet has a rigidity greater than that of the first heat transfer sheet and is provided with through-holes. The first heat transfer sheet has a thermal conductivity and an elasticity greater than those of the second heat transfer sheet, and is pushed into the through-holes to thermally connect the circuit component to the heat sink.
Claims17
An electronic device comprising:
- an electronic circuit;
- a heat sink configured to dissipate heat generated by the circuit;
- and
- a first heat transfer sheet and a second heat transfer sheet positioned adjacent to each other between the circuit and the heat sink, and configured to thermally connect the circuit and the heat sink to each other,
- wherein rigidity of the second heat transfer sheet is higher than rigidity of the first heat transfer sheet, and the second heat transfer sheet comprises a through-hole;
- and
- wherein a thermal conductivity and elasticity of the first heat transfer sheet are greater than a thermal conductivity and elasticity of the second heat transfer sheet, and the first transfer sheet is partially in the through-hole in order to thermally connect the circuit to the heat sink.
Dependencies are inferred from the claim text.