Heat sink assembly
AssigneesHONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., Hon Hai Precision Industry Co., Ltd.
InventorsLEI GUO, YU-HSU LIN, JENG-DA WU, CHIH-HANG CHAO, YANG LI, LIANG-LIANG CAO
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Abstract
A heat sink assembly includes a printed circuit board, an electronic component mounted on the printed circuit board, and a heat sink mounted on the printed circuit board for dissipating heat from the electronic component. The printed circuit board includes a heat-conduction layer. The heat sink includes a base configured to contact the heat-conduction layer, and a main body extending upward from the base configured to contact the electronic component. The cross section of the base is larger than the cross section of the main body. A plurality of fins extends from the main body.
Claims8
A heat sink assembly, comprising:
- a printed circuit board comprising a heat-conduction layer;
- an electronic component mounted on the printed circuit board;
- and
- a heat sink mounted on the printed circuit board and configured to dissipate heat from the electronic component, the heat sink comprising:
- a base configured to contact the heat-conduction layer;
- and
- a main body extending upward from the base and configured to contact the electronic component, wherein a cross section of the base is larger than a cross section of the main body;
- the main body comprising a plurality of fins extending from the main body.
Dependencies are inferred from the claim text.