Method for producing a micromechanical structural element and semiconductor arrangement

A method for producing a micromechanical structure element on or in a crystal substrate, wherein the micromechanical structure element is arranged in vibratable fashion in a recess of a first main area of one of the two main areas of the crystal substrate, is connected to an edge of the recess of the crystal substrate by means of a web and has a main direction arranged approximately perpendicular to the edge, comprising the steps of:

• providing the crystal substrate;
• depositing an etching mask layer;
• locally removing the etching mask layer, such that the remaining etching mask layer protects the micromechanical structure element to be formed and the web of said structure element against an etching attack and has a border having a first line section and a second line section, which extend from both sides of a connection region of the web to the crystal substrate and have a predeterminable angle φ of less than 180 degrees with respect to one another, in order to obtain a high structural accuracy of the micromechanical structure element;
• and
• etching the crystal substrate in order to form the recess and the micromechanical structure element, such that a line at which a crystal plane of the recess that has been uncovered by the etching touches the first main area of the crystal substrate runs through the connection region;
• wherein the predeterminable angle φ is defined from an interval of more than 160 and less than 180 angular degrees.