Wave Soldering Bath
OwnerMitsuo Zen, Satoshi Ozawainventors
Life of this patent
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Abstract
Problem: In a conventional wave soldering bath, oxides which intermixed with molten solder were sucked into a duct from a suction port of the duct and were discharged from a discharge nozzle and adhered to printed circuit boards. Means for Solving the Problem: In a wave soldering bath according to the present invention, an oxide reservoir is provided at one end of the bath body which is opposite from the end thereof where a pump is installed, and a gutter which is closed off on the pump side is mounted on the side surface of the discharge nozzle. A perforated plate having a large number of holes formed therein is pivotably installed at a middle height of the oxide reservoir.
Claims13
1-4. (canceled)
A wave soldering bath comprising a bath body, a discharge nozzle disposed in the bath body, a discharge pump disposed in the bath body and fluidly communicating with the discharge nozzle, an oxide reservoir formed inside the bath body at an end of the bath body, a gutter extending alongside the discharge nozzle and having an exit opening onto the oxide reservoir, a perforated plate pivotably disposed in the oxide reservoir below the exit of the gutter, and a lever secured to and extending upwards from the perforated plate for use in pivoting the perforated plate inside the oxide reservoir.
A method of operating a wave soldering bath comprising:
- discharging molten solder from a discharge nozzle disposed in a bath body into a gutter extending alongside the discharge nozzle;
- discharging the molten solder from the gutter into an oxide reservoir disposed inside the bath body at an end of the gutter;
- and
- passing molten solder discharged from the gutter through a perforated plate submerged in molten solder inside the oxide reservoir and pivotably supported inside the reservoir to collect oxides inside the molten solder.
Dependencies are inferred from the claim text.