Method and system for performing multiple treatments in a dual-chamber batch processing system
AssigneeTokyo Electron Limited
InventorMitsunori Ohata
Life of this patent
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Abstract
A processing system for treating a plurality of substrates is described. The processing system comprises a first batch processing system configured to chemically treat the plurality of substrates and a second batch processing system configured to thermally treat the plurality of substrates. A transfer system is coupled to the first batch processing system and the second batch processing system, and configured to transfer the plurality of substrates into and out of each batch processing system. Furthermore, a control system is coupled to the first batch processing system, the second batch processing system and the transfer system, and configured to execute a chemical removal process.
Claims20
A processing system for treating a plurality of substrates, comprising:
- a first batch processing system configured to chemically treat said plurality of substrates;
- a second batch processing system configured to thermally treat said plurality of substrates;
- a transfer system coupled to said first batch processing system and said second batch processing system, and configured to transfer said plurality of substrates into and out of said first batch processing system and transfer said plurality of substrates into and out of said second batch processing system;
- and
- a control system coupled to said first batch processing system, said second batch processing system and said transfer system, and configured to execute a chemical removal process, wherein said chemical removal process comprises chemically treating said plurality of substrates in said first batch processing system in order to chemically alter exposed surface layers on said plurality of substrates and thermally treating said plurality of substrates in said second batch processing system in order to elevate a temperature of the plurality of substrates and cause evaporation of said chemically altered exposed surface layers.
A method for treating a plurality of substrates, comprising:
- loading a plurality of substrates into a first batch processing system using a transfer system;
- chemically treating said plurality of substrates by exposing said plurality of substrates to a gas composition comprising as incipient ingredients HF and optionally ammonia (NH3);
- removing said plurality of substrates from said first batch processing system using said transfer system;
- after said removing, loading said plurality of substrates into a second batch processing system using said transfer system;
- and
- thermally treating said plurality of substrates by heating said plurality of substrates.
A method for treating a plurality of substrates, comprising:
- loading a first plurality of substrates into a first batch processing system using a transfer system;
- concurrently loading a second plurality of substrates into a second batch processing system using said transfer system;
- chemically treating said first plurality of substrates by exposing said first plurality of substrates to a gas composition comprising as incipient ingredients HF and optionally ammonia (NH3);
- and
- thermally treating said second plurality of substrates by heating said second plurality of substrates.
Dependencies are inferred from the claim text.