Adhesive tape joining apparatus
AssigneeNitto Denko Corporation
InventorsMasayuki Yamamoto, Saburo Miyamoto
Life of this patent
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Abstract
An adhesive tape joining apparatus of this invention adopts an inverted “T”-shaped layout configured with a rectangular section that extends laterally when being viewed in a plane and a protrusion section that is coupled on a center of the rectangular section. An adhesive tape joining part is disposed in the protrusion section and joins an adhesive tape to a ring frame and a wafer. A transport mechanism is disposed in the rectangular section and transports the wafer, the ring frame, and the wafer held by the ring frame. An electronic substrate processing unit is disposed in at least one of two regions adjoining to the rectangular section with the protrusion section being interposed therebetween, and is coupled to the transport mechanism.
Claims10
An adhesive tape joining apparatus for joining an adhesive tape to a ring frame and an electronic substrate to hold the electronic substrate by the ring frame,
- the adhesive tape joining apparatus adopting an inverted “T”-shaped layout configured with a rectangular section that extends laterally when being viewed in a plane and a protrusion section that is coupled on a center of the rectangular section,
- the adhesive tape joining apparatus comprising:
- an adhesive tape joining part that is disposed in the protrusion section and joins the adhesive tape to the ring frame and the electronic substrate;
- and
- a transport mechanism that is disposed in the rectangular section and transports the electronic substrate, the ring frame, and the electronic substrate held by the ring frame, wherein
- an electronic substrate processing unit is disposed in at least one of two regions adjoining to the rectangular section with the protrusion section being interposed therebetween, and is coupled to the transport mechanism.
Dependencies are inferred from the claim text.