Method for manufacturing multilayer electronic component

Abstract

The present invention aims to provide a method for manufacturing a multilayer electronic component capable to remove a multilayer body very easily from the press mold without breaking the multilayer body when removing a green sheet multilayer body applied with a pressure from the press mold, furthermore has no waste of material, contributes to the environment conservation, and also easy to automate. Among the plurality of green sheets constituting a multilayer body 4a, the adhesive force of at least one of the outer green sheet 14a1 contacting to the lower mold 20 of the press mold 20 is made weaker compared to that of other green sheet 14a2, 10a, 14a3, and 14a4 of which are stacked with said outer green sheet 14a1. Next, a pressure is applied to the multilayer body 4a on the lower mold 20 of the press mold. Then, the press mold 25 is removed from the multilayer body 4a which is applied with the pressure.

Dependencies are inferred from the claim text.