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US 2009/0211167 A1Published application
Slurry for wire saw
AssigneeSumco Corporation
InventorsSatoshi MATAGAWA, Akira NAKASHIMA, Takahisa NAKASHIMA, Kazushige TAKAISHI
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Abstract
A wire saw slurry containing, in a dispersing medium, 0.01-1 wt % of a metal film forming substance or a chelating agent that forms a film over copper in the dispersing medium. Entry of copper into a wafer bulk is prevented by the metal film forming substance or the chelating agent capturing the copper leaching out from brass plating of wires.
Claims21
A wire saw slurry containing a dispersing medium and loose abrasive grains dispersed into the dispersing medium, the slurry comprising:
- one of a film forming substance and a chelating agent that forms a metal film with respect to copper in the dispersing medium.
Dependencies are inferred from the claim text.