Structure for reducing stress for vias and fabricating method thereof

A fabricating method of a structure for reducing stress for vias, comprising the following steps:

• providing at least a first conductor;
• forming at least a stress block at the position corresponding to the first conductor, wherein the stress block is in a lattice structure;
• forming an insulation layer to cover the first conductor, and the stress block;
• forming at least a through hole passing through the interior of the stress block in the insulation layer corresponding to the first conductor;
• and
• forming at least a second conductor on the insulation layer, and forming a via in each through hole, to connect the first conductor and the second conductor by the via.