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US 2009/0155985 A1Published application
Inhibition of Metal Diffusion Arising from Laser Dicing
AssigneeInternational Business Machines Corporation
InventorsMukta G. Farooq, Robert Hannon, Da-Young Jung
Life of this patent
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Abstract
A method divides a wafer into at least one chip. The chip includes internal metallic features. The dividing deposits at least one metallic substance on the outer surface of the chip. After so dividing the chip, the process exposes the chip to a heated ambient environment having a given pressure (e.g., less than one atmosphere). The environment comprises a chemical agent capable of bonding with the metallic substance. Additionally, wet chemical etch can be performed on the chip.
Claims20
A method comprising:
- dividing a wafer into at least one chip, wherein said chip includes internal metallic features, and wherein said dividing deposits at least one metallic substance on a surface of said chip;
- after said dividing, exposing said chip to a heated ambient environment having a certain partial pressure of a gaseous chemical agent, wherein said chemical agent is capable of bonding with said metallic substance;
- and
- removing said chip from said environment.
1 more element
A method comprising:
- dividing a wafer into at least one chip, wherein said chip includes internal metallic features, and wherein said dividing deposits at least one metallic substance on a surface of said chip;
- after said dividing, exposing said chip to a heated ambient environment having a certain partial pressure of a gaseous chemical agent, wherein said chemical agent is capable of bonding with said metallic substance;
- and
- performing a wet chemical etch on said chip.
1 more element
A method comprising:
- dividing a wafer into at least one chip, wherein said chip includes internal metallic features, and wherein said dividing deposits at least one metallic substance on a surface of said chip, wherein said metallic substance comprises one of Copper, Aluminum, and Tungsten;
- after said dividing, exposing said chip to a heated ambient environment having a certain partial pressure of a gaseous chemical agent, wherein said chemical agent is capable of bonding with said metallic substance;
- and
- performing a wet chemical etch on said chip.
1 more element
Dependencies are inferred from the claim text.