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US 2009/0155934 A1Published application
Deposition apparatus and deposition method
AssigneesKochi Industrial Promotion Center, Casio Computer Co., Ltd.
InventorsKazuhito NISHIMURA, Hideki SASAOKA
Life of this patent
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Abstract
A deposition apparatus includes: a first electrode for placing a processing object; a second electrode for generating plasma with the first electrode, the second electrode being opposed to the first electrode; and a heat flow control heat transfer part for drawing heat from the processing object to generate a heat flow from a central area to a peripheral area of the processing object.
Claims27
A deposition apparatus comprising:
- a first electrode for placing a processing object;
- a second electrode for generating plasma with the first electrode, the second electrode being opposed to the first electrode;
- and
- a heat flow control heat transfer part for drawing heat from the processing object to generate a heat flow from a central area to a peripheral area of the processing object.
1 more element
A deposition apparatus comprising:
- a first electrode for placing a processing object;
- a placing stage for placing the first electrode;
- a second electrode for generating plasma with the first electrode, the second electrode being opposed to the first electrode;
- and
- a heat flow control heat transfer part for differentiating a thermal resistance between a first area of the processing object where a density of active species contributing to deposition by the plasma is high and the placing stage from a thermal resistance between a second area where a density of the active species contributing to the deposition is lower than that in the first area and the placing stage to control a temperature distribution within a substrate surface.
2 more elements
A deposition apparatus comprising:
- a first electrode for placing a processing object;
- a placing stage for placing the first electrode;
- a second electrode for generating plasma with the first electrode, the second electrode being opposed to the first electrode;
- and
- a heat flow control heat transfer part for, in order to attain a uniform film property between a first area of the processing object where a density of active species contributing to deposition by the plasma is high and a second area where a density of the active species contributing to the deposition is lower than that in the first areas decreasing a thermal resistance from the second area of the processing object to the placing stage as compared with a thermal resistance from the first area to the placing stage.
2 more elements
A deposition method comprising:
- a step of placing a processing object on a first electrode;
- and
- a deposition step of generating plasma between the first electrode and a second electrode to deposit a film on a surface of the processing object with a heat flow being generated from a central area to a peripheral area of the processing object by a heat flow control heat transfer part.
Dependencies are inferred from the claim text.