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US 2009/0154111 A1Published application
Reticulated heat dissipation
OwnerThomas W. Lynchinventor
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Abstract
Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.
Claims21
An apparatus comprising:
- a substrate;
- two or more microelectronic components coupled to the substrate;
- wherein the two or more microelectronic components are located to extend substantially perpendicular to the substrate;
- and
- a heat dissipation device comprising a fin plate, wherein the fin plate is coupled to the two or more microelectronic components, and wherein the fin plate is located to extend substantially perpendicular to the substrate between the two or more microelectronic components.
2 more elements
An apparatus comprising:
- a substrate;
- two or more microelectronic components coupled to the substrate;
- wherein the two or more microelectronic components are located to extend substantially perpendicular to the substrate;
- and
- a heat dissipation device comprising a fin plate, wherein the fin plate is coupled to the two or more microelectronic components, and wherein the fin plate is located to extend substantially perpendicular to the substrate between the two or more microelectronic components;
- a bus coupled to the microelectronic component;
- and
- a memory device coupled to the bus.
5 more elements
A method comprising:
- coupling two or more microelectronic components substantially perpendicular to a substrate;
- and
- coupling a heat dissipation device comprising a fin plate to the two or more microelectronic components, and wherein the fin plate is located to extend substantially perpendicular to the substrate between the two or more microelectronic components.
Dependencies are inferred from the claim text.