Heat dissipation device and a method for manufacturing the same

A heat dissipation device adapted for dissipating heat generated by an electronic component mounted on a printed circuit board, the heat dissipation device comprising:

• a first heat sink comprising a plurality of fins;
• a second heat sink contacting with the electronic component and comprising a base and a plurality of fins extending from the base and spaced from each other, a groove defined in the base, a width of a bottom portion of the groove being shorter than that of a top portion;
• and
• a heat pipe comprising an flattened evaporating portion directly embedded in the groove of the second heat sink and a condensing portion extending through the fins of the first heat sink.

A method for manufacturing a heat dissipation device, comprising the steps of:

• providing a heat sink having a base and a plurality of fins mounted on the base;
• providing a heat pipe having an evaporating portion;
• punching a groove in the base, the groove having a pair of opposite side walls, wherein a distance between the walls at a top is larger than that at a bottom;
• and
• pressing the evaporating portion of the heat pipe into the groove to render the evaporating portion to be flattened to have a contact with an electronic component.