Heat dissipating assembly having a fan duct
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsHAO LI, TAO LI, JUN ZHANG
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Abstract
A heat dissipating assembly for dissipating heat from a graphic card and a hard disk driver (30), includes a heat sink (10) for contacting the graphic card and a fan duct (20) fixed on the heat sink. The fan duct is made by bending a planar metal plate and has a first portion soldered to a top face of the heat sink and a second portion slantwise and upwardly extending from the first portion. When a fan (40) generates an airflow towards the heat sink, a part of the airflow flows through the heat sink to remove heat in the heat sink, and another part of the airflow is guided slantwise and upwardly by the second portion of the fan duct to flow through the hard disk driver, thereby to cool the hard driver.
Claims16
A heat dissipating assembly adapted for dissipating heat generated by a plurality of electronic devices, the heat dissipating assembly comprising:
- a heat sink having a bottom portion adapted for absorbing the heat from one of the plurality of electronic devices, the heat sink adapted for being located near a fan;
- and
- a fan duct being mounted on the heat sink, comprising a first plate fixed on a top portion of the heat sink, and a second plate extending slantwise and upwardly from the first plate, wherein when the fan is in operation, a lower part of an airflow produced by the fan flows through the heat sink to remove the heat in the heat sink from the one of the plurality of electronic devices, and an upper part of the airflow is guided upwardly and slantwise by the fan duct to flow through another one of the plurality of electronic devices, thus cooling the another one of the plurality of electronic devices.
An electronic device assembly comprising:
- an electronic device;
- another electronic device located above the electronic device;
- a heat sink mounted on the electronic device;
- a folded plate fixed on the heat sink;
- and
- a fan located near the heat sink, wherein when the fan is in operation, a part of an airflow generated by the fan flows through the heat sink, another part of the airflow is led slantwise and upwardly by the folded plate to flow through the another electronic device.
Dependencies are inferred from the claim text.