Single fan tray in a midplane architecture
AssigneeJuniper Networks, Inc.
InventorTri Luong Nguyen
Life of this patent
Estimating the term…
Abstract
A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.
Claims25
A chassis, comprising:
- a front section that contains a first electronic circuit board oriented in a first plane;
- a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal;
- a midplane dividing the front and the rear sections;
- and
- a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.
A method for cooling a device having a midplane design, the method comprising:
- directing a first airflow having a first direction to provide a second airflow having a second direction, the second direction being orthogonal to the first direction;
- cooling, via the second airflow, a first electronic circuit board of the device, the first electronic circuit board being orthogonal to the midplane;
- redirecting the second airflow to provide a third airflow having a third direction, the third direction being orthogonal to the second direction;
- redirecting the third airflow to provide a fourth airflow having a fourth direction, the fourth direction being orthogonal to the third direction;
- and
- cooling, via the fourth airflow, a second electronic circuit board of the device.
A device, comprising:
- a first array of circuit boards oriented in a first direction in a first compartment of a chassis;
- a second array of circuit boards oriented in a second direction in a second compartment of the chassis, the second direction being different than the first direction;
- a midplane connecting one or more circuit boards of the first array of circuit boards with one or more circuit boards of the second array of circuit boards;
- and
- a fan tray assembly having a plurality of fans disposed on a plane of the first compartment to cool both the first array of circuit boards and the second array of circuit boards.
A device, comprising:
- a first plurality of circuit boards oriented in a horizontal direction;
- a second plurality of circuit boards oriented in a vertical direction;
- a vertically oriented midplane providing a connection between one or more circuit boards of the first plurality of circuit boards and one or more circuit boards of the second plurality of circuit boards;
- and
- a fan system oriented on a plane that is parallel to the second plurality of circuit boards to cool both the first plurality of circuit boards and the second plurality of circuit boards.
A device, comprising:
- a midplane connecting a first circuit board oriented orthogonal to a second circuit board;
- a chassis;
- and
- a cooling mechanism oriented on a plane corresponding to a side of the chassis, where the cooling mechanism pulls air to cool both the first circuit board and the second circuit board.
Dependencies are inferred from the claim text.