Exposure apparatus, exposure method, and device fabrication method

An exposure method using an exposure apparatus including a projection optical system which projects a pattern of a reticle onto a substrate, comprising:

• a specifying step of specifying a first region on a pupil plane of the projection optical system based on the pattern of the reticle and a shape of an effective light source on the pupil plane of the projection optical system;
• and
• an adjusting step of adjusting an aberration of the projection optical system,
• wherein in the adjusting step, the aberration of the projection optical system is adjusted so that an aberration in the first region specified in the specifying step becomes smaller than an aberration in a second region on the pupil plane of the projection optical system, which is different from the first region.

A device fabrication method comprising steps of:

• exposing a substrate using an exposure apparatus;
• and
• performing a development process for the substrate exposed,
• wherein said exposure apparatus includes:
• a projection optical system configured to project a pattern of a reticle onto the substrate;
• a specifying unit configured to specify a first region on a pupil plane of said projection optical system based on the pattern of the reticle and a shape of an effective light source on the pupil plane of said projection optical system;
• and
• an adjusting unit configured to adjust an aberration of said projection optical system,
• wherein said adjusting unit adjusts the aberration of said projection optical system so that an aberration in the first region specified by said specifying unit becomes smaller than an aberration in a second region on the pupil plane of said projection optical system, which is different from the first region.